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Jan 30, 2020 - Pixillion Image Converter Plus 7.13 Crack includes a library of 1000+ .1. Field of the Invention

The present invention relates to a method of manufacturing a thin, flat plate-shaped polishing pad for use in a polishing apparatus, a polishing pad fabricated by such method, and a polishing apparatus provided with such a polishing pad.

2. Description of the Related Art

In recent years, semiconductor devices have been increasingly integrated. The progress of large-scale integrated circuits has made the problem of metal wiring delay a serious problem. To prevent the deterioration of signal transmission speed due to resistance and capacitance of an interconnect and delay of signals, insulating films for insulating an interconnect and insulating films between interconnects have been reduced in thickness. The reduction of film thickness has caused problems such as the occurrence of insulation defects and the reduction of reliability.

Interposing a CMP (Chemical Mechanical Polishing) film between wirings and forming a film on the surface of a substrate to be polished (hereafter, referred to as a wafer), thereby planarizing the wafer surface by mechanical friction and chemical action has been considered to prevent the problems. By forming a flattening film made of SiO2, for example, on the wafer surface and a polishing film having lower hardness than the wafer surface so that the polishing film is scratched by a rotating polishing pad while pressing the polishing pad onto the wafer, the surface of the wafer is planarized. The flattening film and the polishing film can be regarded as an interconnect.

Interconnects consist of copper (Cu), aluminum (Al), or the like. Although

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